Assignment: Illustrate twenty (20) different small electronic components like capacitors and chip sets in cut-away format for use in trade show graphics, sales sheets, and on-line.

Challenge: The first challenge was to find a consistent view that would work for every component despite the many varied shapes and internal configurations. The second challenge was to work with both good and bad CAD translations. In many instances parts of the geometry had to be rebuilt to spec. A third challenge existed because several of the parts did not have anything more than line drawings to work from and 3D assets had to be built from scratch. The final challenge was trying to find a way to peel back and cut parts to clearly demonstrate the layering present within these small to tiny complex electronic components.

Results: A master set of new images that Kemet can use to promote and sell their products. Additional 3D assets were then created to allow Kemet to 3D print selected components in cut away fashion to accompany the illustrations.

Media: Technical illustration, 3D printing

Techniques: 3D modeling, compositing